Product Description

The AW***1eR & AW***3eR single-wafer dry etchers are automated tools designed as a flexible *3.*6MHz RF Parallel Plate plasma etching systems for high-volume wafer fabrication. AW***1eR & AW***3eR are in direct response to manufacturers concerns for wafer breakage, Uniformity, Uptime, Reliability, and Production-Proven technology
AW***1eR /AW**3eR Applications:
Polysilicon Etch
Nitride Etch
Silicon Nitride Etch
Silicides Etch
Silicon Dioxide Etch
Polyimide Etch
Polyimide ILD Etch
LDD Spacer Etch
BCB Etch
Zero Layer Etch
Backside Etch
Pad Etch
Passivation Etch
Oxide/Contact/Via Etch (Down to 0.8um)
Titanium/Tantalum Alloy
Resist/SOG Planarization
Descum
AW***1eR/ AW**3eR Key Features:
Production-proven plasma etching system.
Up to 3%*5% Uniformity.
Frontside and backside isotropic and anisotropic etch.
Process Temperature: ***5°C .
*5mm***0mm wafer capability.
Integrated solid robotic wafer handling. Single wafer process.
Fixed cassette station and wafer aligner/cooling station.
Can handle *0um thickness wafer.
PC controller with Advanced Allwin*1 Software.
Endpoint detection with Allwin*1 SLOPE technology. (Optional)
Up to 4 gas lines with MFCs.
MKS *3.*6 MHz RF Air-Cooled Generator **0W, **0W, or ***0W.
Pressure control with UPC. Throttle valve is optional.
Touch screen GUI.
EMO, Interlocks, and Watchdog function.
GEM/SECS II (Optional)
Small Footprint
Made in U.S.A.
AW***1eR/ AW***3eR Software Key Features:
Real time graphics display, process data acquisition, and analysis.
Closed-loop process parameters control.
Precise parameters profiles tailored to suit specific process requirements.
Programmable comprehensive calibration of all subsystems from within the software. This allows faster, easier calibration, leading to enhanced process results.
Recipe creation to ensure process repeatability. It features a recipe editor to create and edit recipes to fully automate the processing of wafers inside the process chamber.
Validation of the recipe so improper control sequences will be revealed.
Storage of multiple recipes, process data, and calibration files so that process & calibration results can be maintained or compared over time.
Passwords provide security for the system, recipe editing, diagnostics, calibration, and setup functions.
Simple and easy to use menu screen which allow a process cycle to be easily defined and executed.
Troubleshooting features which allows engineers and service personnel to activate individual subassemblies and functions. More I/O and AD/DA exposure.
DB**5F parallel (printer) port.  The computer interfaces to the Allwin*1 system with only one cable: the control interface cable.
The control board inside the machine that translates the computer commands to control the machine has a watchdog timer. If this board loses communication with the control software, it will shut down all processes and halt the system until communication is restored.
GEM/SECS II function (Optional).
Advanced Allwin*1 Endpoint Detection function (Optional).
AW***1eR/ AW**3eR Specifications:
Up to 6 inch Capability
Throughput: ****0 WPH, Process Dependent
Temperature: ***5ºC (±2 ºC) capability
Gas Lines: 4 gas lines with MFCs.
Etcher Rate: AW***1eR: *****0A/minute; AW***3eR: *****0A/minute, Process Dependent
Uniformity: Up to ±3%, Process Dependent
Particulate: <0.*5 /cm2 (0.*3um or greater)
Selectivity: **1eR: ***0:1 ;    AW***3eR: ***0:1, Process Dependent
MTBF/MTTA/MTTR: **0 Hours/**0 Hours/3.5 Hours or Better. *5% uptime
* Contact Allwin*1 sales for other applications and specifications
AW***1eR/ AW***3eR Configuration:
Main Frame, Standard
Pentium Class PC with AW Software
Keyboard, Mouse, USB with SW backup, and Cables
Chuck
① 3;  ② 4;  ③ 5;  ④ 6
Wafer Aligner/Cooling Station
*-Axis Integrated Solid Robot
① H-Zero (Standard);  ② H**7X*0.5 (TTW)
Fixed Cassette Station
Chuck Assembly
① **1eR Non-anodized;   ② **3eR Anodized /W Flat
③ **3eR Anodized /wo Flat ④ **3eR Non-anodized /W Flat
Reactor Assembly
① **1eR Non-anodized;  ② **3eR Anodized
③ **3eR Non-anodized;  ④ **3eR High Performance
⑤ Direct Cooling;       ⑥ Non-Direct Cooling
Pins
① Quartz;  ② Ceramic;  ③ SST
Centering Ring
① Aluminum;  ② Quartz;  ③ Ceramic
Main Control Board
Gas Box /w 4 inline Gas Lines, MFC, filters, and Pneumatic valves
RF Matching Network with PCB
*3.*6 MHz RF Generator (Air or Water Cooled)
① MKS Elite:**0HD;   ② MKS Elite:**0HD
③ MKS Elite:***0HD; ④ ENI ACG 3; ⑤ ENI ACG *0
AC/DC Box
ATM Sensor
UPC Pressure Control
① **5 SCCM,**1eR;  ② ***0 SCCM, **3eR
MKS Baratron with Pneumatic Isolation Valve
Main Vacuum Valves
Front EMO, Interlocks
**-inch Touch Screen GUI
AW***1eR/ AW***3eR Options:
EOP Module with PCB
GEM/SECS II function (Software)
Lamp tower alarm with buzzer
Throttle Valve Pressure Control
Vacuum Pump
Chiller for chuck and chamber
Through The Wall